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| MC10SX1190 Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit Description The MC10SX1190 is a differential receiver, differential transmitter specifically designed to drive coaxial cables. It incorporates the output cable drive capability of the MC10EP89 Coaxial Cable Driver with additional circuitry to multiplex the output cable drive source between the cable receiver or the local transmitter inputs. The multiplexer control circuitry is TTL compatible for ease of operation. The MC10SX1190 is useful as a bypass element for Fibre Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture (SSA) applications, to create loop style interconnects with fault tolerant, active switches at each device node. This device is particularly useful for back panel applications where small size is desirable. The EP89 style drive circuitry produces swings approximately 70% larger than a standard PECL output. When driving a coaxial cable, proper termination is required at both ends of the line to minimize reflections. The 1.4 V output swings allow for proper termination at both ends of the cable, while maintaining the required swing at the receiving end of the cable. Because of the larger output swings, the QT, QT outputs are terminated into the thevenin equivalent of 50 W to VCC - 3.0 V instead of 50 W to VCC - 2.0 V. Features http://onsemi.com MARKING DIAGRAM 10SX 1190 ALYWG G TSSOP-20 DT SUFFIX CASE 948E A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. PIN DESCRIPTION PIN DR/DR QR/QR DT/DT QT/QT SEL VBB VCC VBB 12 VEE 11 VEE FUNCTION ECL Diff. Inputs from Receive Cable ECL Buffered Differential Outputs from Receive Cable ECL Differential Input to Transmit Cable ECL Buffered Differential Output to Transmit Cable TTL Multiplexer Control Signal Reference Voltage Output ECL Positive Supply ECL Negative, 0 Supply * * * * * * * 2.5 Gb/s Operation 425 ps Propagation Delay 1.4 V Output Swing on the Cable Driving Output Single Positive SUpply Operation Ranges: VCC = 3.0 V to 3.6 V, VEE = 0 V VCC = 4.5 V to 5.5 V, VEE = 0 V 75 kW Internal Input Pull Down Resistors ESD Protection: 2000 V Human Body Model, >100 V Machine Model These are Pb-Free Devices* VCC 20 VCC 19 QR 18 QR 17 VEE 16 DT 15 DT 14 VCC 13 TRUTH TABLE SEL L H 1 VEE 2 DR 3 DR 4 VCC 5 VCC 6 QT 7 QT 8 VEE 9 SEL 10 VCC Function DR QT DT QT ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 1. 20-Lead TSSOP Pinout: (Top View) *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2006 January, 2006 - Rev. 3 1 Publication Order Number: MC10SX1190/D MC10SX1190 LOCAL RECEIVE DATA (ECL LEVELS) QR QR VBB LOCAL TRANSMIT DATA (ECL LEVELS) 1 DT DT 0 QT QT TO OUTPUT CABLE (ENHANCED SWING) DR DR FROM INPUT CABLE (ECL LEVELS) SEL (TTL) Figure 2. Logic Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Symbol VCC VEE VIN VIN IOUT qJA qJC TA TSTG Parameter Power Supply Voltage (VEE = 0 V) Power Supply Voltage (VCC = 0 V) Input Voltage (VEE = 0 V, VIN not more positive than VCC) Input Voltage (VCC = 0 V, VIN not more negative than VEE) Output Current Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Operating Temperature Range Storage Temperature Range Continuous Surge Still Air 500 lfpm Value 0 to +6.0 -6.0 to 0 0 to +6.0 -6.0 to 0 50 100 90 60 30 to 35 -40 to +85 -50 to +150 Unit Vdc Vdc Vdc Vdc mA C/W C/W C C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC10SX1190 Table 2. DC CHARACTERISTICS (VCC = 3.3 V, VEE = 0 V) (Note 1) -40C Symbol VOH VOL VOH VOL ICC VIH VIL VIH VIL VBB Characteristic Output Voltage High (QR,QR) (Note 2) Output Voltage Low (QR,QR) (Note 2) Output Voltage High (QT,QT) (Note 3) Output Voltage Low (QT,QT) (Note 3) Quiescent Supply Current (Note 4) Input Voltage High Input Voltage Low Input Voltage High SEL (Note 5) Input Voltage Low SEL (Note 5) Output Reference Voltage (Note 1) 1.80 1.90 Min 2.22 1.35 2.13 0.50 30 2070 1350 2.0 0.8 2.05 1.80 1.90 Typ 2.35 1.54 2.29 0.67 60 Max 2.52 1.65 2.40 1.10 90 2410 1800 Min 2.27 1.37 2.18 0.48 30 2170 1350 2.0 0.8 2.05 1.85 1.95 25C Typ 2.39 1.57 2.33 0.64 60 Max 2.57 1.67 2.46 1.06 90 2490 1820 Min 2.30 1.40 2.20 0.44 30 2240 1350 2.0 0.8 2.05 85C Typ 2.40 1.57 2.34 0.63 60 Max 2.60 1.71 2.48 1.06 90 2580 1860 Unit V V V V mA mV mV V V V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters will track 1:1 VCC. VEE can vary +0.3 V to -0.3 V. 2. QR outputs loaded with 50 W to VCC - 2.0 V 3. QT outputs loaded with 50 W to VCC - 3.0 V 4. Outputs open circuited. 5. TTL signal threshold is 1.5 V above VEE. Table 3. DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0 V) (Note 6) -40C Symbol VOH VOL VOH VOL ICC VIH VIL VIH VIL VBB IIL IIH Characteristic Output Voltage High (QR,QR) (Note 7) Output Voltage Low (QR,QR) (Note 7) Output Voltage High (QT,QT) (Note 8) Output Voltage Low (QT,QT) (Note 8) Quiescent Supply Current (Note 9) Input Voltage High Input Voltage Low Input Voltage High SEL (Note 10) Input Voltage Low SEL (Note 10) Output Reference Voltage (Note 6) Input High Current Input LOW Current 0.5 3.50 3.60 Min 3.92 3.05 3.83 1.90 30 3770 3050 2.0 0.8 3.75 150 0.5 3.50 3.60 Typ 4.05 3.24 3.99 2.14 60 Max 4.22 3.35 4.11 2.50 90 4110 3500 Min 3.97 3.07 3.88 1.85 30 3870 3050 2.0 0.8 3.75 150 0.5 3.55 3.65 25C Typ 4.09 3.27 4.03 2.09 60 Max 4.27 3.37 4.16 2.45 90 4190 3520 Min 4.0 3.10 3.90 1.85 30 3940 3050 2.0 0.8 3.75 150 85C Typ 4.10 3.27 4.04 2.08 60 Max 4.30 3.41 4.18 2.45 90 4280 3560 Unit V V V V mA mV mV V V V mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters will track 1:1 VCC. VEE can vary +0.5 V to -0.5 V. 7. QR outputs loaded with 50 W to VCC - 2.0 V 8. QT outputs loaded with 50 W to VCC - 3.0 V 9. Outputs open circuited. 10. TTL signal threshold is 1.5 V above VEE. http://onsemi.com 3 MC10SX1190 Table 4. AC CHARACTERISTICS (VCC = 3.0 V to 5.5 V, VEE = 0 V) (Note 11) -40C Symbol tpd Characteristic Propagation Delay-to-Output DR QR (Diff) (Notes 12 and 13) DR QT (Diff) DT QT (Diff) tPLH, tPHL tr, tf tr, tf tskew VPP VCMR fmax Propagation Delay (1.5 V to 50% Pt) Rise Time (20% to 80%) Fall Time (80% to 20%) Rise Time (20% to 80%) Fall Time 80% to 20% Within Device Skew (Note 14) Input Swing (Differential Configuration) Common Mode Range (Note 15) Maximum Operation Frequency 200 3.0 2.5 SEL QT,QT QR,QR QT,QT Min 140 300 280 400 70 150 Typ 240 400 380 700 140 200 15 1000 4.35 200 3.0 2.5 Max 340 500 480 1000 200 280 25C to 85C Min 180 350 350 400 90 150 Typ 280 470 440 700 155 230 230 15 1000 4.35 Max 380 650 650 1000 250 500 ps ps ps ps mV V Gb/s Unit ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. VEE can vary +0.3 V to -0.3 V 12. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 13. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. 14. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device. 15. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V. http://onsemi.com 4 MC10SX1190 VEE Rpd QT Rt ZO ZO QT Rpd SX1190 VEE VEE Rpd QR ZO ZO QR Rpd VEE Rt Rt = ZO Typical value for Rpd is 160 W to 260 W, depending on the application. The minimum value of Rpd should not be less than 50 W. VTT1 Rt ZO QT ZO QT Rt SX1190 VTT1 VTT2 Rt VTT1 = VCC - 3 V ZO QR ZO QR VTT2 = VCC - 2 V Rt VTT2 Rt = ZO/2 Figure 3. SX1190 Termination Configuration ORDERING INFORMATION Device MC10SX1190DT MC10SX1190DTG MC10SX1190DTR2 MC10SX1190DTR2G Package TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* Shipping 75 Units / Rail 75 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 5 MC10SX1190 PACKAGE DIMENSIONS TSSOP-20 DT SUFFIX PLASTIC PACKAGE CASE 948E-02 ISSUE B 20X K REF M 0.15 (0.006) T U S 0.10 (0.004) TU S V S L PIN 1 IDENT 1 10 B -U- J J1 N 0.15 (0.006) T U S A -V- N F C D 0.100 (0.004) -T- SEATING PLANE G H DETAIL E ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 IIII IIII IIII SECTION N-N M DETAIL E 2X L/2 20 11 K K1 0.25 (0.010) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ -W- DIM A B C D F G H J J1 K K1 L M MC10SX1190/D |
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